[AK4223]
PACKAGE
48pin LQFP (Unit: mm)
1.70Max
9.0 ± 0.2
0.13 ± 0.13
7.0
1.40 ± 0.05
36
25
37
24
13
48
12
1
0.5
0.09 ∼ 0.20
0.22 ± 0.08
0.10 M
0° ∼ 10°
0.3 ∼ 0.75
0.10
■ Package & Lead Frame Material
Package molding compound:
Lead frame material:
Lead frame surface treatment:
Epoxy
Cu
Solder (Pb free) plate
RoHS Compliance
*All integrated circuits form Asahi Kasei Microdevices Corporation (AKM) assembled in “lead-free”
packages are fully compliant with RoHS.
MS1251-E-00
25
2010/10