10 to 20 SEC.
217 °C
255 °C (+5/-0)
3 °C/SEC. MAX.
100 - 150 °C
6 °C/SEC. MAX.
10 SEC. MAX.
TEMPERATURE
230°C MAX.
140-160°C
4°C/SEC.
MAX.
OVER 2 MIN.
TIME
4°C/SEC. MAX.
3°C/SEC. MAX.
TEMPERATURE
MAX. 120 SEC.
60 to 150 SEC.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 11. Recommended reflow soldering profile.
Figure 12. Recommended Pb-free reflow soldering profile.
5.0 (0.200)
0.9 (0.035)
0.9 (0.035)
1.0 (0.039)
0.2 (0.008)
CENTERING
BOARD
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
1.2
(0.047)
1.2
(0.047)
1.2 (0.047)
0.9
(0.035)
Figure 13. Recommended soldering pattern for HSMx-C110.
Figure 14. Recommended soldering pattern for HSMx-C170/177.
0.8 (0.031)
1.5 (0.059)
0.8
(0.031)
0.7
(0.028)
0.8
(0.031)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
Figure 15. Recommended soldering pattern
for HSMx-C130/190/191/197.
Figure 16. Recommended soldering pattern for HSMx-C150.
0.4 (0.016)
0.4 (0.016)
2.2 (0.087) DIA. PCB HOLE
0.7 (0.028)
0.15 (0.006)
CENTERING
BOARD
0.8
(0.031)
1.2
(0.047)
0.8
(0.031)
1.25 (0.049)
1.4
(0.055)
2.3
(0.091)
1.4
(0.055)
Figure 17. Recommended soldering pattern for HSMx-C120.
Figure 18. Recommended soldering pattern for HSMx-C265.
NOTE:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
9
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
