Package Dimensions, continued
3.4 (0.134)
LED DIE
0.8 (0.031)
1.25 (0.049)
(0.625)
GREEN SOLDER MASK
POLARITY
UNDIFFUSED
EPOXY
1.1 (0.043)
PC BOARD
0.12 (0.005)
0.3 (0.012)
CATHODE LINE
0.50 ± 0.15
(0.020 ± 0.006)
0.50 ± 0.15
(0.020 ± 0.006)
CATHODE LINE
0.3 ± 0.15
(0.012 ± 0.006)
0.3 ± 0.15
(0.012 ± 0.006)
1.2
(0.047)
DIFFUSED EPOXY
1.1 (0.043)
PCB BOARD
1.15
(0.045)
0.23 (0.009)
0.35 (0.014)
1.6
(0.063)
POLARITY
CATHODE
MARK (ETCHED)
LED DIE
CATHODE
MARK
0.7 (0.028) MIN.
SOLDERING
TERMINAL
SOLDERING
TERMINAL
HSMx-C265
NOTES:
1. ALL DIMENSIONS IN MILLIMETERS (INCHES).
2. TOLERANCE IS ± 0.1 mm (± 0.004 IN.) UNLESS OTHERWISE SPECIFIED.
HSMx-C130
Device Selection Guide
Package Dimension (mm)
[1], [2]
3.2(L) x 1.0(W) x 1.5(H)
1.6(L) x 0.6(W) x 1.0(H)
1.6(L) x 0.8(W) x 0.35(H)
3.2(L) x 1.6(W) x 1.1(H)
2.0(L) x 1.25(W) x 0.8(H)
2.0(L) x 1.25(W) x 0.4(H)
1.6(L) x 0.8(W) x 0.8(H)
1.6(L) x 0.8(W) x 0.6(H)
1.6(L) x 0.8(W) x 0.4(H)
3.4(L) x 1.25(W) x 1.1(H)
Notes:
1. Dimensions in mm.
InGaN Green
HSMQ-C110
HSMQ-C120
–
HSMQ-C150
HSMQ-C170
HSMQ-C177
HSMQ-C190
HSMQ-C191
HSMQ-C197
HSMQ-C265
InGaN Blue
HSMR-C110
HSMR-C120
HSMR-C130
HSMR-C150
HSMR-C170
HSMR-C177
HSMR-C190
HSMR-C191
HSMR-C197
HSMR-C265
Package Description
Untinted, Non-diffused
Untinted, Non-diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Diffused
Untinted, Non-diffused
2. Tolerance
±
0.1 mm unless otherwise noted.
Absolute Maximum Ratings at T
A
= 25˚C
Parameter
DC Forward Current
[1]
Power Dissipation
Reverse Voltage (I
R
= 100
µA)
LED Junction Temperature
Operating Temperature Range
Storage Temperature Range
Soldering Temperature
Note:
1. Derate linearly as shown in Figure 4.
HSMQ-Cxxx
HSMR-Cxxx
20
78
5
95
–30 to +85
–40 to +85
See reflow soldering profile (Figures 11 & 12)
Units
mA
mW
V
˚C
˚C
˚C
4
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
