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HSMF-C155 参数 Datasheet PDF下载

HSMF-C155图片预览
型号: HSMF-C155
PDF下载: 下载PDF文件 查看货源
内容描述: 表面贴装芯片LED [Surface Mount Chip LEDs]
分类和应用: 可见光LED光电功效
文件页数/大小: 8 页 / 240 K
品牌: AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
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7
4.00 (0.157)
1.50 (0.059)
CATHODE
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
CARRIER TAPE
USER FEED
DIRECTION
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
PART NUMBER
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
1.40 (0.055)
HSMF-C15x SERIES 3.52 (0.139) 3.02 (0.119)
Figure 10. Tape Dimensions.
END
START
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface
Mounting SMT LED Indicator
Components.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Figure 11. Tape Leader and Trailer Dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is
±
0.1 mm (± 0.004 in.) unless otherwise specified.
Storage Condition: 5 to 30˚C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.