7
4.00 (0.157)
1.50 (0.059)
CATHODE
DIM. C
(SEE TABLE 1)
0.20 ± 0.05
(0.008 ± 0.002)
1.75 (0.069)
3.50 ± 0.05
(0.138 ± 0.002)
DIM. A
(SEE TABLE 1)
8.00 ± 0.30
(0.315 ± 0.012)
DIM. B
(SEE TABLE 1)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 (0.157)
CARRIER TAPE
USER FEED
DIRECTION
COVER TAPE
TABLE 1
DIMENSIONS IN MILLIMETERS (INCHES)
PART NUMBER
DIM. A
DIM. B
DIM. C
± 0.10 (0.004) ± 0.10 (0.004) ± 0.10 (0.004)
1.40 (0.055)
HSMF-C15x SERIES 3.52 (0.139) 3.02 (0.119)
Figure 10. Tape Dimensions.
END
START
Convective IR Reflow
Soldering
For more information on IR
reflow soldering, refer to
Application Note 1060,
Surface
Mounting SMT LED Indicator
Components.
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MOUNTED WITH
COMPONENTS
THERE SHALL BE A
MINIMUM OF 160 mm
(6.3 INCH) OF EMPTY
COMPONENT POCKETS
SEALED WITH COVER
TAPE.
MINIMUM OF
230 mm
(9.05 INCH)
MAY CONSIST
OF CARRIER
AND/OR
COVER TAPE.
Figure 11. Tape Leader and Trailer Dimensions.
Notes:
1. All dimensions in millimeters (inches).
2. Tolerance is
±
0.1 mm (± 0.004 in.) unless otherwise specified.
Storage Condition: 5 to 30˚C
@ 60% RH max.
Baking is required under the
condition:
a) the blue silica gel indicator
becoming white/transparent
color
b) the pack has been opened for
more than 1 week
Baking recommended condition:
60 +/– 5˚C for 20 hours.