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HSMF-C155 参数 Datasheet PDF下载

HSMF-C155图片预览
型号: HSMF-C155
PDF下载: 下载PDF文件 查看货源
内容描述: 表面贴装芯片LED [Surface Mount Chip LEDs]
分类和应用: 可见光LED光电功效
文件页数/大小: 8 页 / 240 K
品牌: AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
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5
100
I
F
– FORWARD CURRENT – mA
1.6
LUMINOUS INTENSITY
(NORMALIZED AT 20 mA)
HER
10
GREEN
1.2
0.8
1
YELLOW
0.1
ORANGE
1.5
1.7
1.9
2.1
2.3
0.4
0
0
10
20
30
40
V
F
– FORWARD VOLTAGE – V
I
F
– FORWARD CURRENT – mA
Figure 2. Forward Current vs.
Forward Voltage.
Figure 3. Luminous Intensity vs. Forward
Current (All Colors).
I
F MAX.
– MAXIMUM FORWARD CURRENT – mA
35
RELATIVE INTENSITY – %
1.00
0.90
0.80
0.70
0.60
0.50
0.40
0.30
0.20
0.10
30
25
20
15
10
5
0
0
20
40
60
80
100
J-A
= 600°C/W
J-A
= 800°C/W
0
-90 -80 -70 -60 -50 -40 -30 -20 -10
0
10 20 30 40 50 60 70 80 90
T
A
– AMBIENT TEMPERATURE – °C
ANGLE
Figure 4. Maximum Forward Current
vs. Ambient Temperature.
Figure 5. Relative Intensity vs. Angle for
HSMx-C155, C156 and C157.
10 to 20 SEC.
217 °C
TEMPERATURE
255 °C (+5/-0)
3 °C/SEC. MAX.
1.0 (0.039)
6 °C/SEC. MAX.
140 - 160 °C
0.4 (0.016)
MAX. 120 SEC.
60 to 150 SEC.
1.0 (0.039)
1.5
(0.059)
2.0
(0.079)
1.5
(0.059)
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Note:
1. All dimensions in millimeters (inches).
Figure 6. Recommended Pb Free Reflow Soldering Profile.
Figure 7. Recommended Solder Pad Pattern.