1.2 Recommended Metal Solder
Stencil Aperture
It is recommended that only a
0.152 mm (0.006 inches) or a
0.127 mm (0.005 inches) thick
stencil be used for solder
paste printing. This is to
ensure adequate printed solder
paste volume and no shorting.
See the table below the
drawing for combinations of
metal stencil aperture and
metal stencil thickness that
should be used.
Aperture opening for shield
pad is 2.7 mm x 1.25 mm as
per land pattern.
Apertures as
per land
Dimensions
t
w
l
Aperture size (mm)
Stencil Thickness, t (mm)
0.152 mm
0.127 mm
Length, l (mm)
2.60 ± 0.05
3.00 ± 0.05
Width, w (mm)
0.55 ± 0.05
0.55 ± 0.05
1.3 Adjacent Land Keepout and
Solder Mask Areas
Adjacent land keep-out is the
maximum space occupied by
the unit relative to the land
pattern. There should be no
other SMD components within
this area. The minimum solder
resist strip width required to
avoid solder bridging adjacent
pads is 0.2 mm. It is
recommended that two fiducial
crosses be place at midlength
of the pads for unit alignment.
Note: Wet/Liquid Photo-
Imageable solder resist/mask is
recommended.
7.2
0.2
2.6
Solder mask
Units: mm
3.0
11
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