Package
The optical subassemblies utilize The outer housing including the
The overall package concept for
the Agilent transceiver consists
of three basic elements; the two
optical subassemblies, an
electrical subassembly, and the
housing as illustrated in the
block diagram in Figure 1.
a high-volume assembly process
together with low-cost lens
elements which result in a cost-
effective building block.
MT-RJ ports is molded of filled
nonconductive plastic to provide
mechanical strength and
electrical isolation. The solder
posts of the Agilent design are
isolated from the internal circuit
of the transceiver.
The electrical subassembly con-
sists of a high volume multilayer
printed circuit board on which
the IC and various surface-
mounted passive circuit
The package outline drawing
and pin out are shown in
Figures 2 and 3. The details of
this package outline and pin out
are compliant with the multi-
source definition of the 2 x 5
DIP. The low profile of the
Agilent transceiver design
complies with the maximum
height allowed for the MT-RJ
connector over the entire length
of the package.
The transceiver is attached to a
printed circuit board with the
ten signal pins and the two
solder posts which exit the
bottom of the housing. The two
solder posts provide the primary
mechanical strength to
withstand the loads imposed on
the transceiver by mating with
the MT-RJ connectored fiber
cables.
elements are attached.
The receiver section includes an
internal shield for the electrical
and optical subassemblies to
ensure high immunity to
external EMI fields.
RX SUPPLY
DATA OUT
DATA OUT
QUANTIZER IC
PIN PHOTODIODE
PRE-AMPLIFIER
SUBASSEMBLY
RX GROUND
TX GROUND
SIGNAL
DETECT
MT-RJ
RECEPTACLE
LED
DATA IN
DATA IN
OPTICAL
SUBASSEMBLY
LED DRIVER IC
TX SUPPLY
Figure 1. Block Diagram.
2
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
