Solder and Wash Process
Compatibility
Board Layout - Decoupling Circuit,
Ground Planes and Termination
Circuits
It is important to take care in
the layout of your circuit board
to achieve optimum perform-
ance from these transceivers.
Figure 7 provides a good
example of a schematic for a
power supply decoupling circuit
Board Layout - Hole Pattern
The Agilent transceiver complies
with the circuit board “Common
Transceiver Footprint” hole
pattern defined in the original
multisource announcement
which defined the 2 x 5 package
style. This drawing is repro-
duced in Figure 9 with the
addition of
The transceivers are delivered
with protective process plugs
inserted into the MT-RJ
receptacle. This process plug
protects the optical
subassemblies during wave
solder and aqueous wash
processing and acts as a dust
cover during shipping.
that works well with these parts. ANSI Y14.5M compliant
It is further recommended that a dimensioning to be used as a
These transceivers are compat-
ible with either industry
standard wave or hand solder
processes.
contiguous ground plane be
provided in the circuit board
directly under the transceiver to
provide a low inductance
ground for signal return current.
This recommendation is in
keeping with good high
guide in the mechanical layout
of your circuit board.
Shipping Container
The transceiver is packaged in a
shipping container designed to
protect it from mechanical and
ESD damage during shipment or
storage.
frequency board layout
practices. Figures 7 and 8 show
two recommended termination
schemes.
TERMINATE AT
TRANSCEIVER INPUTS
PHY DEVICE
VCC (+3.3 V)
VCC (+3.3 V)
10 nF
130 Ω
130 Ω
Z = 50 Ω
TD-
LVPECL
Z = 50 Ω
TD+
82 Ω
82 Ω
10
9
8
7
6
VCC (+3.3 V)
VCC (+3.3 V)
10 µF
1 µH
C2
TX
VCC (+3.3 V)
10 nF
C3
RX
130 Ω
130 Ω
RD+
RD-
1 µH
C1
1
2
3
4
5
LVPECL
Z = 50 Ω
Z = 50 Ω
Z = 50 Ω
VCC (+3.3 V)
82 Ω
82 Ω
10 nF
130 Ω
82 Ω
SD
TERMINATE AT DEVICE INPUTS
Note: C1 = C2 = C3 = 10 nF or 100 nF
Figure ꢀ. Alternative Termination Circuits
7
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
