欢迎访问ic37.com |
会员登录 免费注册
发布采购

HFBR-2521 参数 Datasheet PDF下载

HFBR-2521图片预览
型号: HFBR-2521
PDF下载: 下载PDF文件 查看货源
内容描述: 多功能连接的通用光纤连接 [Versatile Link The Versatile Fiber Optic Connection]
分类和应用: 光纤
文件页数/大小: 20 页 / 410 K
品牌: AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
 浏览型号HFBR-2521的Datasheet PDF文件第1页浏览型号HFBR-2521的Datasheet PDF文件第2页浏览型号HFBR-2521的Datasheet PDF文件第4页浏览型号HFBR-2521的Datasheet PDF文件第5页浏览型号HFBR-2521的Datasheet PDF文件第6页浏览型号HFBR-2521的Datasheet PDF文件第7页浏览型号HFBR-2521的Datasheet PDF文件第8页浏览型号HFBR-2521的Datasheet PDF文件第9页  
3
when making connections.
Receivers are blue and transmit-
ters are gray, except for the
HFBR-15X3 transmitter, which is
black.
Handling
Versatile Link components are
auto-insertable. When wave
soldering is performed with
Versatile Link components, the
optical port plug should be left in
to prevent contamination of the
port. Do not use reflow solder
processes (i.e., infrared reflow or
vapor-phase reflow).
Nonhalogenated water soluble
fluxes (i.e., 0% chloride), not
rosin based fluxes, are recom-
mended for use with Versatile
Link components.
Versatile Link components are
moisture sensitive devices and
are shipped in a moisture sealed
bag. If the components are
exposed to air for an extended
period of time, they may require
a baking step before the solder-
ing process. Refer to the special
labeling on the shipping tube for
details.
CAUTION
This bag contains
MOISTURE-SENSITIVE
DEVICES
Recommended Chemicals for
Cleaning/Degreasing
Alcohols:
methyl, isopropyl,
isobutyl.
Aliphatics:
hexane,
heptane,
Other:
soap solution,
naphtha.
Do not use
partially halogenated
hydrocarbons such as 1,1.1
trichloroethane, ketones such as
MEK, acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride, or N-
methylpyrolldone. Also, Agilent
does not recommend the use of
cleaners that use halogenated
hydrocarbons because of their
potential environmental harm.
Level
4
1. Shelf life in sealed bag: 12 months at < 40°C and < 90% Relative
Humidity (RH).
2. After this bag is opened, devices that will be subjected to wave
soldering, or equivalent processing (solder temperature < 260°C for
10 sec) must be:
a) Mounted within 72 hours at factory conditions of
30
°C/60%
RH.
b) Stored at
20% RH.
3. Devices require baking, before mounting, if:
a) Desiccant changes to PINK.
b) If 2a or 2b are not met.
4. If baking is required, devices may be baked outside of tube for 20
hours at 75°C.
Bag Seal Date: ______________________________________________________
(If blank, see barcode label)
Note: LEVEL defined by EIA JEDEC Standard J-STD-020
Mechanical Dimensions
Horizontal Modules
Vertical Modules
2.0
(0.080)
6.8
(0.270)
10.2
(0.400)
18.8
(0.740)
5.1
(0.200)
4.2
(0.165)
7.6
(0.30)
0.64
(0.025)
7.71
7.6
(0.305)
(0.30)
18.8
0.740
7.62
(0.300)
3.81 (0.150) MAX.
3.56 (0.140) MIN.
0.51
(0.020)
1.27
(0.050)
2.5
(0.100)
0.64 (0.025) DIA.
2.8
(0.109)
1.85
(0.073)