Solder Reflow Temperature Profile
300
PREHEATING RATE 3˚C + 1˚Cꢀ–0.5˚CꢀSEC.
REFLOW HEATING RATE 2.5˚C 0.5˚CꢀSEC.
PEAK
TEMP.
245˚C
PEAK
TEMP.
240˚C
PEAK
TEMP.
230˚C
200
100
0
2.5˚C 0.5˚CꢀSEC.
SOLDERING
TIME
200˚C
30
160˚C
150˚C
140˚C
SEC.
30
SEC.
3˚C + 1˚Cꢀ–0.5˚C
PREHEATING TIME
150˚C, 90 + 30 SEC.
50 SEC.
TIGHT
TYPICAL
LOOSE
0
50
100
150
200
250
ROOM TEMPERATURE
TIME (SECONDS)
Recommended Pb-Free IR Profile
TIME WITHIN 5 ˚C of ACTUAL
PEAK TEMPERATURE
t
p
20-40 SEC.
260 +0ꢀ-5 ˚C
T
p
217 ˚C
T
L
RAMP-UP
3 ˚CꢀSEC. MAX.
RAMP-DOWN
6 ˚CꢀSEC. MAX.
150 - 200 ˚C
T
smax
T
smin
t
s
t
L
60 to 150 SEC.
PREHEAT
60 to 180 SEC.
25
t 25 ˚C to PEAK
TIME (SECONDS)
NOTES:
THE TIME FROM 25 ˚C to PEAK TEMPERATURE = 8 MINUTES MAX.
= 200 ˚C, T = 150 ˚C
T
smax
smin
4
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
