3
8-Pin DIP Package with Gull Wing Surface Mount Option 300 (HCPL-4100)
PAD LOCATION (FOR REFERENCE ONLY)
9.65 ± 0.25
(0.380 ± 0.010)
1.016 (0.040)
1.194 (0.047)
6
5
8
1
7
4.826
(0.190)
TYP.
6.350 ± 0.25
(0.250 ± 0.010)
9.398 (0.370)
9.906 (0.390)
2
3
4
0.381 (0.015)
0.635 (0.025)
1.194 (0.047)
1.778 (0.070)
9.65 ± 0.25
(0.380 ± 0.010)
1.780
(0.070)
MAX.
1.19
(0.047)
MAX.
7.62 ± 0.25
(0.300 ± 0.010)
+ 0.076
- 0.051
0.254
4.19
+ 0.003)
- 0.002)
MAX.
(0.165)
(0.010
1.080 ± 0.320
(0.043 ± 0.013)
0.635 ± 0.25
(0.025 ± 0.010)
12° NOM.
0.635 ± 0.130
(0.025 ± 0.005)
2.54
(0.100)
BSC
DIMENSIONS IN MILLIMETERS (INCHES).
LEAD COPLANARITY = 0.10 mm (0.004 INCHES).
Thermal Profile (Option #300)
260
240
220
∆T = 145°C, 1°C/SEC
∆T = 115°C, 0.3°C/SEC
200
180
160
140
120
100
80
∆T = 100°C, 1.5°C/SEC
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
TIME – MINUTES
Figure 1. Maximum Solder Reflow Thermal Profile.
(Note: Use of non-chlorine activated fluxes is recommended.)
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
