Package Outline Drawing
HCPL-354-000E
2.54
± 0.25
3.60 ± 0.3
5.30 ± 0.3
354
DATE CODE *1
4.40 ± 0.2
2.00 ± 0.2
0.2 ± 0.05
Y WW
LEAD
FREE
+ 0.2
– 0.7
0.10 ± 0.1
0.40 ± 0.1
7.00
RANK *2
DIMENSIONS IN MILLIMETERS.
HCPL-354-060E
2.54
± 0.25
3.60 ± 0.3
5.30 ± 0.3
354 V
DATE CODE *1
2.00 ± 0.2
0.2 ± 0.05
Y WW
4.40 ± 0.2
LEAD
FREE
+ 0.2
– 0.7
0.10 ± 0.1
0.40 ± 0.1
7.00
RANK *2
DIMENSIONS IN MILLIMETERS.
30 seconds
Solder Reflow Temperature Profile
260°C (Peak Temperature)
1) One-time soldering reflow is
recommended within the
250°C
217°C
200°C
condition of temperature and
time profile shown at right.
150°C
2) When using another soldering
method such as infrared ray
lamp, the temperature may rise
partially in the mold of the
60 sec
25°C
60 ~ 150 sec
90 sec
Time (sec)
60 sec
device. Keep the temperature on
the package of the device within
the condition of (1) above.
2
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
