8 Pin Ceramic DIP Single Channel Schematic
2
+
V
F
CATHODE
-
3
5
I
F
I
CC
I
B
I
O
8
7
6
V
CC
V
B
V
O
ANODE
GND
Note, base is pin 7.
Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
1
V
B1
V
CC1
V
O1
GND
16
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
1
16
20 Pad LCCC
Surface Mount
2 Channels
15 14
V
CC2
19
20
V
B2
V
O2
GND
2
V
O1
GND
1
V
CC1
V
B1
7
8
13
12
1
2
3
15
V
CC
V
B
V
OUT
8
1
V
CC
V
O1
V
O2
8
2
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
14
2
14
7
6
2
3
7
3
3
4
13
6
4
13
2
3
10
9
4
5
V
B2
V
CC2
GND
V
O2
12
GND
5
4
GND
5
5
12
6
7
11
10
6
7
11
10
8
9
8
9
Note: 8 pin DIP and flat pack devices have common V
CC
and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated
channels with separate V
CC
and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
4
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