Maximum Solder Reflow Thermal Profile
260
240
220
200
180
160
140
120
100
80
60
40
20
0
0
1
2
3
4
5
6
7
8
9
10
11
12
∆T
= 145°C, 1°C/SEC
∆T
= 115°C, 0.3°C/SEC
TEMPERATURE – °C
∆T
= 100°C, 1.5°C/SEC
TIME – MINUTES
Note: Use of nonchlorine activated fluxes is highly recommended.
Regulatory Information
The HCPL-2200/2219 have been
approved by the following
organizations:
UL
Recognized under UL 1577,
Component Recognition
Program, File E55361.
CSA
Approved under CSA Component
Acceptance Notice #5, File CA
88324.
VDE
Approved according to VDE
0884/06.92. (HCPL-2219 Option
060 Only)
Insulation and Safety Related Specifications
Parameter
Symbol
Value
Units
Conditions
Min. External Air Gap L(IO1)
7.1
mm
Measured from input terminals to output terminals,
(External Clearance)
shortest distance through air.
Min. External
L(IO2)
7.4
mm
Measured from input terminals to output terminals,
Tracking Path
shortest distance path along body.
(External Creepage)
Minimum Internal
0.08
mm
Through insulation distance, conductor to conductor,
Plastic Gap
usually the direct distance between the photoemitter
(Internal Clearance)
and photodetector inside the optocoupler cavity.
Tracking Resistance
CTI
200
V
DIN IEC 112/VDE 0303 Part 1
(Comparative
Tracking Index)
Isolation Group
IIIa
Material Group (DIN VDE 0110, 1/89, Table 1)
Option 300 - surface mount classification is Class A in accordance with CECC 00802.
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