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ATF-34143-TR1 参数 Datasheet PDF下载

ATF-34143-TR1图片预览
型号: ATF-34143-TR1
PDF下载: 下载PDF文件 查看货源
内容描述: 低噪声赝HEMT的表面贴装塑料封装 [Low Noise Pseudomorphic HEMT in a Surface Mount Plastic Package]
分类和应用:
文件页数/大小: 15 页 / 153 K
品牌: AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
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ATF-34143 Absolute Maximum Ratings
[1]
Symbol
V
DS
V
GS
V
GD
I
D
P
diss
P
in max
T
CH
T
STG
θ
jc
Parameter
Drain - Source Voltage
[2]
Gate - Source Voltage
[2]
Gate Drain Voltage
[2]
Drain Current
[2]
Total Power Dissipation
[4]
RF Input Power
Channel Temperature
Storage Temperature
Thermal Resistance
[5]
Units
V
V
V
mA
mW
dBm
°C
°C
°C/W
Absolute
Maximum
5.5
-5
-5
I
dss [3]
725
17
160
-65 to 160
165
Notes:
1. Operation of this device above any one
of these parameters may cause
permanent damage.
2. Assumes DC quiescent conditions.
3. V
GS
= 0 volts.
4. Source lead temperature is 25°C.
Derate 6 mW/
°C
for T
L
> 40°C.
5. Thermal resistance measured using
150°C Liquid Crystal Measurement
method.
6. Under large signal conditions, V
GS
may
swing positive and the drain current
may exceed I
dss
. These conditions are
acceptable as long as the maximum
P
diss
and P
in max
ratings are not
exceeded.
Product Consistency Distribution Charts
[7]
250
+0.6 V
120
100
80
200
Cpk = 1.37245
Std = 0.66
9 Wafers
Sample Size = 450
I
DS
(mA)
150
0V
-3 Std
60
+3 Std
100
40
50
–0.6 V
20
0
29
0
0
2
4
V
DS
(V)
6
8
30
31
32
33
34
35
OIP3 (dBm)
Figure 1. Typical/Pulsed I-V
(V
GS
= -0.2 V per step)
Curves
[6]
.
Figure 2. OIP3 @ 2 GHz, 4 V, 60 mA.
LSL=29.0, Nominal=31.8, USL=35.0
120
100
80
Cpk = 2.69167
Std = 0.04
9 Wafers
Sample Size = 450
120
100
80
Cpk = 2.99973
Std = 0.15
9 Wafers
Sample Size = 450
-3 Std
60
40
20
0
0
0.2
0.4
NF (dB)
+3 Std
60
40
20
0
16
-3 Std
+3 Std
0.6
0.8
16.5
17
17.5
18
18.5
19
GAIN (dB)
Figure 3. NF @ 2 GHz, 4 V, 60 mA.
LSL=0.1, Nominal=0.47, USL=0.8
Figure 4. Gain @ 2 GHz, 4 V, 60 mA.
LSL=16.0, Nominal=17.5, USL=19.0
Notes:
7. Distribution data sample size is 450
samples taken from 9 different wafers.
Future wafers allocated to this product
may have nominal values anywhere
within the upper and lower spec limits.
8. Measurements made on production
test board. This circuit represents a
trade-off between an optimal noise
match and a realizeable match based
on production test requirements.
Circuit losses have been de-embedded
from actual measurements.
2