20 SEC. MAX.
240°C MAX.
3°C/ SEC. MAX.
100-150°C
183°C
–6°C/ SEC.
MAX.
3°C/ SEC.
MAX.
120 SEC. MAX.
60-150 SEC.
TIME
Figure 6a. Recommended Sn-Pb reflow soldering profile.
10 to 20 SEC.
+5 °C
-0 °C
255 °C
217 °C
3 °C/ SEC. MAX.
6 °C/ SEC. MAX.
125 °C ± 25 °C
MAX. 120 SEC.
60 to 150 SEC.
TIME
* THE TIME FROM 25 °C TO PEAK TEMPERATURE = 6 MINUTES MAX.
Figure 6b. Recommended Pb-free reflow soldering profile.
LAMINAR WAVE
HOT AIR KNIFE
TURBULENT WAVE
250
200
150
100
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
CONVEYOR SPEED = 1.83 M/ MIN (6 FT/ MIN)
PREHEAT SETTING = 150°C (100°C PCB)
SOLDER WAVE TEMPERATURE = 245°C
AIR KNIFE AIR TEMPERATURE = 390°C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40°
FLUXING
SOLDER: SN63; FLUX: RMA
50
30
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
PREHEAT
0
10
20
30
40
50
60
70
80
90 100
TIME – SECONDS
Figure 7. Recommended wave soldering profile.
5
AGILENT [ AGILENT TECHNOLOGIES, LTD. ]
