IR Reflow Soldering
Figure 25 is a straight-line
representation of the recom-
mended nominal time-tempera-
ture profile from JESD22-A113-B
IR reflow.
235
200
183
150
100
50
60 to 150s
above 183°C
0
30
60
90
120
150
180
210
240
270
300
TIME (seconds)
Preheat
Zone
Soak
Zone
Reflow
Zone
Cooling
Zone
Figure 25. Time-temperature Profile for IR Reflow Soldering Process.
Table 2. IR Reflow Process Zone.
Process Zone
∆Temperature
∆Temperature/∆Time
Preheat Zone
Soak Zone
25°C to 100°C
100°C to 150°C
3°C/s MAX
0.5°C/s MAX (120s MAX)
Reflow Zone
150°C to 235°C (240°C MAX)
235°C to 150°C
4.5°C/s TYP
-4.5°C/s TYP
Cooling Zone
150°C to 25°C
-6°C/s MAX
Table 3. Classification Reflow Profiles.
Convection or IR/Convection
Average ramp-up rate (183°C to peak)
Preheat temperature 125 (± 25)°C
Temperature maintained above 183°C
Time within 5°C of actual peak temperature
Peak temperature range
3°C/second max.
120 seconds max.
60 – 150 seconds
10 – 20 seconds
220 +5/-0°C or 235 +5/-0°C
6°C/second max.
6 minutes max.
Ramp-down rate
Time 25°C to peak temperature
Note:
All temperatures measured refer to the package body surface.
20
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