Data Sheet
June 1999
ORCA Series 3C and 3T FPGAs
Pin Information (continued)
Package Compatibility
Table 68 provides the number of user I/Os available for the ORCA Series 3 FPGAs for each available package.
Each package has six dedicated configuration pins.
Tables 70—75 provide the package pin and pin function for the ORCA Series 3 FPGAs and packages. The bond
pad name is identified in the PIC nomenclature used in the ORCA Foundry design editor.
When the number of FPGA bond pads exceeds the number of package pins, bond pads are unused. When the
number of package pins exceeds the number of bond pads, package pins are left unconnected (no connects).
When a package pin is to be left as a no connect for a specific die, it is indicated as a note in the device pad column
for the FPGA. The tables provide no information on unused pads.
Table 68. ORCA I/Os Summary
208-Pin
SQFP/SQPF2
240-Pin
SQFP/SQFP2
256-Pin
PBGA
352-Pin
PBGA
432-Pin
EBGA
600-Pin
EBGA
Device
OR3T20
User I/Os*
171
31
6
192
40
6
192
26
6
192
48
6
—
—
—
—
—
—
—
—
DD SS
V
/V
Configuration
Unused
0
2
32
106
OR3T30
User I/Os*
171
31
6
192
40
6
221
26
6
224
48
6
—
—
—
—
—
—
—
—
DD SS
V
/V
Configuration
Unused
0
2
3
74
OR3C/T55
User I/Os*
171
31
6
192
42
6
223
26
6
288
48
6
—
—
—
—
—
—
—
—
DD SS
V
/V
Configuration
Unused
0
0
1
10
OR3C/T80
User I/Os*
171
31
6
192
42
6
—
—
—
—
298
48
6
342
84
6
—
—
—
—
DD SS
V
/V
Configuration
Unused
0
0
0
0
OR3T125
User I/Os*
171
31
6
192
42
6
—
—
—
—
298
48
6
342
84
6
448
140
6
DD SS
V
/V
Configuration
Unused
0
0
0
0
6
*User I/O count includes four ExpressCLK inputs.
Lucent Technologies Inc.
153
AGERE [ AGERE SYSTEMS ]
