0.015
0.008
6
PIN NO. 1 ID.
k
0.015
0.008
k
26 PLACES
0.050 BSC
e
-A-
-B-
D
0.740 MAX
S1
(4) PLACES
0.000 MIN.
E1
0.036
M
H
A-B
S
D
S
0.550 MAX
0.022
0.015
b
28 PLACES
0.010
7
5
M
H
A-B
S
D
S
5
TOP VIEW
E
0.520
0.460
-D-
c
A
0.009
0.004
0.115
0.045
7
0.040
-H-
-C-
Q
0.045
0.026
E2
0.180 MIN
L
E3
0.030 MIN
0.370
0.250
END VIEW
Notes:
1. All exposed metalized areas to be plated per MIL-PRF-38535.
2. The lid is connected to V
.
SS
3. Lead finishes are in accordance with MIL-PRF-38535.
4. Dimension letters refer to MIL-STD-1835.
5. Lead position and coplanarity are not measured.
6. ID mark symbol is vendor option.
7. With solder, increase maximum by 0.003.
8. Total weight is approximately 2.4 grams.
Figure 5. 28-Lead 50-mil Center Flatpack (0.490 x 0.74)
7
AEROFLEX [ AEROFLEX CIRCUIT TECHNOLOGY ]
