REF19x Series
ABSOLUTE MAXIMUM RATINGS
Table 24.
Parameter1
Rating
THERMAL RESISTANCE
Supply Voltage
Output to GND
−0.3 V, +18 V
−0.3 V, VS + 0.3 V
Indefinite
θJA is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Output to GND Short-Circuit Duration
Storage Temperature Range
PDIP, SOIC_N Package
Operating Temperature Range
REF19x
Junction Temperature Range
PDIP, SOIC_N Package
Lead Temperature Range (Soldering 60 sec)
Table 25. Thermal Resistance
Package Type
1
−65°C to +150°C
−40°C to +85°C
Unit
θJA
θJC
43
43
8-Lead PDIP
8-Lead SOIC_N
103
158
°C/W
°C/W
1 θJA is specified for worst-case conditions; that is, θJA is specified for the device
in socket for PDIP and is specified for the device soldered in the circuit board
for the SOIC package.
−65°C to +150°C
300°C
1 Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. I | Page 15 of 28
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