OP467
10.50 (0.4134)
10.10 (0.3976)
16
9
7.60 (0.2992)
7.40 (0.2913)
1
8
10.65 (0.4193)
10.00 (0.3937)
1.27 (0.0500)
BSC
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
0.75 (0.0295)
0.25 (0.0098)
8°
0°
0.33 (0.0130)
0.20 (0.0079)
45°
SEATING
PLANE
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-013- AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 58. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body (RW-16)
S-Suffix
Dimensions shown in millimeters and (inches)
0.100 (2.54)
0.064 (1.63)
0.075 (1.91)
REF
0.095 (2.41)
0.075 (1.90)
19
18
3
20
1
4
0.200 (5.08)
REF
0.100 (2.54) REF
0.015 (0.38)
MIN
0.028 (0.71)
0.022 (0.56)
0.050 (1.27)
BSC
0.358 (9.09)
0.342 (8.69)
SQ
0.358
(9.09)
MAX
SQ
0.011 (0.28)
0.007 (0.18)
R TYP
0.075 (1.91)
REF
0.055 (1.40)
0.045 (1.14)
BOTTOM
VIEW
14
13
8
9
0.088 (2.24)
0.054 (1.37)
45° TYP
0.150 (3.81)
BSC
022106-A
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 59. 20-Terminal Ceramic Leadless Chip Carrier [LCC]
(E-20-1) RC-Suffix
Dimensions shown in inches and (millimeters)
ORDERING GUIDE
Model
OP467GP
OP467GPZ
OP467GS
OP467GS-REEL
OP467GSZ
OP467GSZ-REEL
1
OP467ARC/883C
OP467AY/883C
OP467GBC
1
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−55°C to +125°C
−55°C to +125°C
Package Description
14-Lead PDIP
14-Lead PDIP
16-Lead SOIC_W
16-Lead SOIC_W
16-Lead SOIC_W
16-Lead SOIC_W
20-Terminal LCC
14-Lead CERDIP
DIE
Package Option
N-14
N-14
RW-16
RW-16
RW-16
RW-16
E-20-1
Q-14
Z = RoHS Compliant Part.
©2007 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00302-0-5/07(F)
Rev. F | Page 20 of 20
032707-B
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