OP1177/OP2177/OP4177
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Input Voltage
Differential Input Voltage
Storage Temperature Range
R, RM, and RU Packages
Operating Temperature Range
OP1177/OP2177/OP4177
Junction Temperature Range
R, RM, and RU Packages
Lead Temperature, Soldering (10 sec)
Rating
36 V
V
S−
to V
S+
±Supply Voltage
−65°C to +150°C
−40°C to +125°C
−65°C to +150°C
300°C
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
8-Lead MSOP (RM-8)
8-Lead SOIC_N (R-8)
14-Lead SOIC_N (R-14)
14-Lead TSSOP (RU-14)
1
θ
JA
190
158
120
240
θ
JC
44
43
36
43
Unit
°C/W
°C/W
°C/W
°C/W
MSOP is available in tape and reel only.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Rev. E | Page 5 of 24
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