OP295/OP495
ABSO LUTE MAXIMUM RATINGS1
D ICE CH ARACTERISTICS
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±18 V
Input Voltage2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .±18 V
Differential Input Voltage2. . . . . . . . . . . . . . . . . . . . . . . +36 V
Output Short-Circuit Duration . . . . . . . . . . . . . . . . . Indefinite
Storage T emperature Range
P, S Package . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Operating T emperature Range
OP295G, OP495G . . . . . . . . . . . . . . . . . . . –40°C to +125°C
Junction T emperature Range
P, S Package . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Lead T emperature Range (Soldering, 60 Sec) . . . . . . . +300°C
3
P ackage Type
JC
Unit
JA
8-Pin Plastic DIP (P)
8-Pin SOIC (S)
14-Pin Plastic DIP (P)
16-Pin SO (S)
103
158
83
43
43
39
30
°C/W
°C/W
°C/W
°C/W
98
OP295 Die Size 0.066 × 0.080 inch, 5,280 sq. m ils.
Substrate (Die Backside) Is Connected to V+.
Transistor Count, 74.
NOT ES
1Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
2For supply voltages less than ±18 V, the absolute maximum input voltage is equal
to the supply voltage.
3θJA is specified for the worst case conditions, i.e., θJA is specified for device in socket
for cerdip, P-DIP, and LCC packages; θJA is specified for device soldered in circuit
board for SOIC package.
OP495 Die Size 0.113 × 0.083 inch, 9,380 sq. m ils.
Substrate (Die Backside) Is Connected to V+.
Transistor Count, 196.
Typical Characteristics
140
15.2
VS = ±15V
RL = 100k
15.0
120
14.8
14.6
14.4
14.2
RL = 10k
RL = 2k
100
80
VS = +36V
VS = +5V
VS = +3V
–14.4
–14.6
–14.8
–15.0
–15.2
60
RL = 2k
RL = 10k
RL = 100k
40
20
–50
–25
0
25
50
75
100
–50
–25
0
25
50
75
100
TEMPERATURE – °C
TEMPERATURE – °C
Supply Current Per Am plifier vs. Tem perature
Output Voltage Swing vs. Tem perature
–4–
REV. B
ADI [ ADI ]
