OP27
TABLE OF CONTENTS
REVISION HISTORY
5/06—Rev. E to Rev. F
Removed References to 745 ..............................................Universal
Updated 741 to AD741 ......................................................Universal
Changes to Ordering Guide .......................................................... 20
12/05—Rev. D to Rev. E
Edits to Figure 2 ................................................................................ 1
9/05—Rev. C to Rev. D
Updated Format..................................................................Universal
Changes to Table 1............................................................................ 4
Removed Die Characteristics Figure ............................................ 5
Removed Wafer Test Limits Table .................................................. 5
Changes to Table 5............................................................................ 7
Changes to Comments on Noise Section .................................... 15
Changes to Ordering Guide .......................................................... 24
1/03—Rev. B to Rev. C
Edits to Pin Connections................................................................. 1
Edits to General Description........................................................... 1
Edits to Die Characteristics............................................................. 5
Edits to Absolute Maximum Ratings ............................................. 7
Updated Outline Dimensions ....................................................... 16
Edits to Figure 8 .............................................................................. 14
Edits to Outline Dimensions......................................................... 16
9/01—Rev. 0 to Rev. A
Edits to Ordering Information ........................................................1
Edits to Pin Connections..................................................................1
Edits to Absolute Maximum Ratings ..............................................2
Edits to Package Type .......................................................................2
Edits to Electrical Characteristics .............................................. 2, 3
Edits to Wafer Test Limits ................................................................4
Deleted Typical Electrical Characteristics......................................4
Edits to Burn-In Circuit Figure .......................................................7
Edits to Application Information ....................................................8
Rev. F | Page 2 of 20
AD [ ANALOG DEVICES ]
