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ADSP-BF531WYBCZ-4A 参数 Datasheet PDF下载

ADSP-BF531WYBCZ-4A图片预览
型号: ADSP-BF531WYBCZ-4A
PDF下载: 下载PDF文件 查看货源
内容描述: Blackfin嵌入式处理器 [Blackfin Embedded Processor]
分类和应用: 微控制器和处理器外围集成电路数字信号处理器时钟
文件页数/大小: 60 页 / 3025 K
品牌: ADI [ ADI ]
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ADSP-BF531/ADSP-BF532  
ORDERING GUIDE  
Temperature  
Package Instruction Operating Voltage  
Option Rate (Max) (Nom)  
Model  
Range1  
Package Description  
ADSP-BF532SBBC400  
–40°C to +85°C 160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
BC-160 400 MHz  
BC-160 400 MHz  
BC-160 400 MHz  
BC-160 400 MHz  
1.2 V internal,  
1.8 V, 2.5 V or 3.3 V I/O  
ADSP-BF532SBBCZ4002  
–40°C to +85°C 160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
1.2 V internal,  
1.8 V, 2.5 V or 3.3 V I/O  
ADSP-BF532WBBCZ-4A2, 3 –40°C to +85°C 160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
ADSP-BF532WYBCZ-4A2, 3 –40°C to +105°C 160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
1.2 V internal, 3.0 V or 3.3 V I/O  
1.2 V internal, 3.0 V or 3.3 V I/O  
ADSP-BF532SBST400  
ADSP-BF532SBSTZ4002  
ADSP-BF532WBSTZ-4A2, 3 –40°C to +85°C 176-Lead Quad Flatpack (LQFP)  
–40°C to +85°C 176-Lead Quad Flatpack (LQFP)  
–40°C to +85°C 176-Lead Quad Flatpack (LQFP)  
ST-176-1 400 MHz  
ST-176-1 400 MHz  
ST-176-1 400 MHz  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 3.0 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 3.0 V or 3.3 V I/O  
1.2 V internal, 3.0 V or 3.3 V I/O  
ADSP-BF532SBB400  
ADSP-BF532SBBZ4002  
–40°C to +85°C 169-Ball Plastic Ball Grid Array (PBGA) B-169  
400 MHz  
400 MHz  
400 MHz  
400 MHz  
–40°C to +85°C 169-Ball Plastic Ball Grid Array (PBGA) B-169  
ADSP-BF532WBBZ-4A2, 3 –40°C to +85°C 169-Ball Plastic Ball Grid Array (PBGA) B-169  
ADSP-BF532WYBZ-4A2, 3 –40°C to +105°C 169-Ball Plastic Ball Grid Array (PBGA) B-169  
ADSP-BF531SBBC400  
–40°C to +85°C 160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
BC-160 400 MHz  
BC-160 400 MHz  
BC-160 400 MHz  
BC-160 400 MHz  
1.2 V internal,  
1.8 V, 2.5 V or 3.3 V I/O  
ADSP-BF531SBBCZ4002  
–40°C to +85°C 160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
1.2 V internal,  
1.8 V, 2.5 V or 3.3 V I/O  
ADSP-BF531WBBCZ-4A2, 3 –40°C to +85°C 160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
ADSP-BF531WYBCZ-4A2, 3 –40°C to +105°C 160-Ball Chip Scale Package  
Ball Grid Array (Mini-BGA)  
1.2 V internal, 3.0 V or 3.3 V I/O  
1.2 V internal, 3.0 V or 3.3 V I/O  
ADSP-BF531SBST400  
ADSP-BF531SBSTZ4002  
ADSP-BF531WBSTZ-4A2, 3 –40°C to +85°C 176-Lead Quad Flatpack (LQFP)  
–40°C to +85°C 176-Lead Quad Flatpack (LQFP)  
ST-176-1 400 MHz  
ST-176-1 400 MHz  
ST-176-1 400 MHz  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 3.0 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 2.5 V or 3.3 V I/O  
1.2 V internal, 3.0 V or 3.3 V I/O  
1.2 V internal, 3.0 V or 3.3 V I/O  
–40°C to +85°C 176-Lead Quad Flatpack (LQFP)  
ADSP-BF531SBB400  
ADSP-BF531SBBZ4002  
–40°C to +85°C 169-Ball Plastic Ball Grid Array (PBGA) B-169  
400 MHz  
400 MHz  
400 MHz  
400 MHz  
–40°C to +85°C 169-Ball Plastic Ball Grid Array (PBGA) B-169  
ADSP-BF531WBBZ-4A2, 3 –40°C to +85°C 169-Ball Plastic Ball Grid Array (PBGA) B-169  
ADSP-BF531WYBZ-4A2, 3 –40°C to +105°C 169-Ball Plastic Ball Grid Array (PBGA) B-169  
1 Referenced temperature is ambient temperature.  
2 Z = Pb-free part.  
3 Automotive grade part.  
©2006 Analog Devices, Inc. All rights reserved. Trademarks and  
registered trademarks are the property of their respective owners.  
D03728-0-8/06(D)  
Rev. D  
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August 2006  
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