ADSP-BF531/ADSP-BF532
BOTTOM VIEW
A1 BALL PAD CORNER
19.00 BSC SQ
16.00 BSC SQ
1.00 BSC
BALL PITCH
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
16 14 12 10
8
6
4
2
17 15 13 11
9
7
5
3
1
TOP VIEW
0.40 MIN
2.50
2.23
1.97
SIDE VIEW
0.20 MAX
COPLANARITY
DETAIL A
SEATING PLANE
0.70
0.60
0.50
DETAIL A
BALL DIAMETER
NOTES
1. DIMENSIONS ARE IN MILLIMETERS.
2. COMPLIES WITH JEDEC REGISTERED OUTLINE
MS-034, VARIATION AAG-2
.
3. MINIMUM BALL HEIGHT 0.40
Figure 61. Plastic Ball Grid Array (PBGA) B-169
SURFACE MOUNT DESIGN
Table 39 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface Mount Design and Land Pat-
tern Standard.
Table 39. BGA Data for Use with Surface Mount Design
Package
Ball Attach Type
Solder Mask Opening
0.40 mm diameter
0.43 mm diameter
Ball Pad Size
Chip Scale Package Ball Grid Array (Mini-BGA) BC-160
Plastic Ball Grid Array (PBGA) B-169
Solder Mask Defined
Solder Mask Defined
0.55 mm diameter
0.56 mm diameter
Rev. D
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Page 59 of 60
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August 2006
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