ADSP-21061/ADSP-21061L
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
Plastic Ball Grid Array (PBGA)
0.913 (23.20)
0.906 (23.00)
0.898 (22.80)
15141312 1110 9
8 7 6 5 4 3 2 1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.700
(17.78)
0.791 (20.10)
0.787 (20.00)
0.783 (19.90)
0.913 (23.20)
0.906 (23.00)
0.898 (22.80)
BSC
TOP VIEW
0.050
(1.27)
BSC
0.791 (20.10)
0.787 (20.00)
0.783 (19.90)
0.050 (1.27) BSC
0.700 (17.78) BSC
DETAIL A
DETAIL A
0.051 (1.30)
0.047 (1.20)
0.043 (1.10)
0.101 (2.57)
0.091 (2.32)
0.081 (2.06)
0.026 (0.65)
0.024 (0.61)
0.022 (0.57)
0.006 (0.15) MAX
SEATING
PLANE
0.035 (0.90)
0.030 (0.75)
NOTE
THE ACTUAL POSITION OF THE BALL GRID IS WITHIN
0.012 (0.30) OF ITS IDEAL POSITION RELATIVE TO THE PACKAGE
EDGES. THE ACTUAL POSITION OF EACH BALL IS WITHIN 0.004 (0.10)
OF ITS IDEAL POSITION RELATIVE TO THE BALL GRID.
0.024 (0.60)
BALL DIAMETER
ORDERING GUIDE
Case Temperature
On-Chip
SRAM
Operating
Voltage
Package
Option
Part Number
Range
Instruction Rate
ADSP-21061KS-133
ADSP-21061KS-160
ADSP-21061KS-200
ADSP-21061LKS-160
ADSP-21061LKS-176
ADSP-21061LAS-160
ADSP-21061LAS-176
ADSP-21061LKB-160
ADSP-21061LKB-176
0°C to +85°C
33 MHz
40 MHz
50 MHz
40 MHz
44 MHz
40 MHz
44 MHz
40 MHz
44 MHz
1 Mbit
1 Mbit
1 Mbit
1 Mbit
1 Mbit
1 Mbit
1 Mbit
1 Mbit
1 Mbit
5 V
5 V
5 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
3.3 V
MQFP
MQFP
MQFP
MQFP
MQFP
MQFP
MQFP
PBGA
PBGA
0°C to +85°C
0°C to +85°C
0°C to +85°C
0°C to +85°C
–40°C Case to +85°C Case
–40°C Case to +85°C Case
0°C to +85°C
0°C to +85°C
The package options are as follows: the ADSP-21061 (5 V) is available in the 240-lead thermally enhanced package and the ADSP-21061L (3.3 V) is available in the
240-lead standard (no heat slug) package, and 225-Ball PBGA.
REV. B
–47–
ADI [ ADI ]
