ADP124/ADP125
Data Sheet
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP124/ADP125.
However, as shown in Table 6, a point of diminishing returns
eventually is reached, beyond which an increase in the copper
size does not yield significant heat dissipation benefits.
The input capacitor should be placed as close as possible to the
VIN and GND pins, and the output capacitor should be placed
as close as possible to the VOUT and GND pins. Use of 0402 or
0603 size capacitors and resistors achieves the smallest possible
footprint solution on boards where the area is limited.
Figure 43. Example ADP125 MSOP PCB Layout
Figure 42. Example ADP124 MSOP PCB Layout
Figure 44. Example ADP124/ADP125 LFCSP PCB Layout
Rev. C | Page 16 of 20
ADI [ ADI ]
