Data Sheet
ADP124/ADP125
JUNCTION TEMPERATURE CALCULATIONS
140
130
120
110
100
90
145
135
125
115
105
95
85
75
80
65
2
2
55
6400 mm
6400 mm
70
2
2
500 mm
500 mm
45
2
2
25 mm
25 mm
60
35
25
T
MAX
T
MAX
J
J
50
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
TOTAL POWER DISSIPATION (W)
TOTAL POWER DISSIPATION (W)
Figure 36. Junction Temperature vs. Power Dissipation and copper area,
MSOP, TA = 25°C
Figure 39. Junction Temperature vs. Power Dissipation and copper area,
LFCSP, TA = 50°C
140
120
100
80
145
135
125
115
105
95
85
60
75
T
T
T
T
= 25°C
= 50°C
= 65°C
= 85°C
MAX
65
B
B
B
B
40
20
0
2
55
45
35
25
6400 mm
2
500 mm
2
25 mm
T
J
T
MAX
J
0
0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50
TOTAL POWER DISSIPATION (W)
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
TOTAL POWER DISSIPATION (W)
Figure 40. Junction Temperature vs. Power Dissipation, MSOP package
at various Board Temperatures
Figure 37. Junction Temperature vs. Power Dissipation and copper area,
LFCSP, TA = 25°C
140
120
100
80
140
130
120
110
100
90
60
T
T
T
T
= 25°C
= 50°C
= 65°C
= 85°C
MAX
80
B
B
B
B
40
20
0
2
6400 mm
70
2
500 mm
2
25 mm
MAX
60
50
T
J
T
J
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 2.8 3.0
TOTAL POWER DISSIPATION (W)
TOTAL POWER DISSIPATION (W)
Figure 38. Junction Temperature vs. Power Dissipation and copper area,
MSOP, TA = 50°C
Figure 41. Junction Temperature vs. Power Dissipation, LFCSP package
at various Board Temperatures
Rev. C | Page 15 of 20
ADI [ ADI ]
