ADM3485E
ABSOLUTE MAXIMUM RATINGS
T
A
= 25°C, unless otherwise noted.
Table 3.
Parameter
V
CC
to GND
Digital Input/Output Voltage (DE, RE, DI)
Receiver Output Voltage (RO)
Driver Output (A, B)/
Receiver Input (A, B) Voltage
Driver Output Current
Power Dissipation (8-Lead SOIC_N)
Operating Temperature Range
Storage Temperature Range
Lead Temperature, Soldering (10 sec)
Vapor Phase (60 sec)
Infrared (15 sec)
ESD Rating
Human Body Model (A, B)
Values
–0.3 V to +6 V
–0.3 V to +6 V
–0.3 V to (V
CC
+ 0.3 V)
−8 V to +13 V
±250 mA
650 mW
–40°C to +85°C
–65°C to +150°C
300°C
215°C
220°C
±15 kV
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
8-Lead SOIC_N
θ
JA
158
Unit
°C/W
ESD CAUTION
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Rev. D | Page 5 of 16
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