ADM3202/ADM3222/ADM1385
6.60
6.50
6.40
20
11
4.50
4.40
4.30
6.40 BSC
1
10
PIN 1
0.65
BSC
0.15
0.05
COPLANARITY
0.10
0.30
0.19
1.20 MAX
0.20
0.09
8°
0°
0.75
0.60
0.45
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MO-153-AC
Figure 26. 20-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-20)
Dimensions shown in millimeters
11.75 (0.4626)
11.35 (0.4469)
18
10
7.60 (0.2992)
7.40 (0.2913)
1
9
10.65 (0.4193)
10.00 (0.3937)
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
1.27
(0.0500)
BSC
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
0.75 (0.0295)
0.25 (0.0098)
8°
0°
0.33 (0.0130)
0.20 (0.0079)
45°
SEATING
PLANE
1.27 (0.0500)
0.40 (0.0157)
COMPLIANT TO JEDEC STANDARDS MS-013-AB
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 27. 18-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-18)
Dimensions shown in millimeters and (inches)
Rev. E | Page 13 of 16
060706-A
AD [ ANALOG DEVICES ]
