ADM3202/ADM3222/ADM1385
5.10
5.00
4.90
16
9
4.50
4.40
4.30
1
8
6.40
BSC
PIN 1
0.15
0.05
0.65
BSC
0.30
0.19
COPLANARITY
0.10
1.20
MAX
0.20
0.09
SEATING
PLANE
8°
0°
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 22. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
10.50 (0.4134)
10.10 (0.3976)
16
9
7.60 (0.2992)
7.40 (0.2913)
1
8
10.65 (0.4193)
10.00 (0.3937)
1.27 (0.0500)
BSC
0.30 (0.0118)
0.10 (0.0039)
COPLANARITY
0.10
0.51 (0.0201)
0.31 (0.0122)
2.65 (0.1043)
2.35 (0.0925)
0.75 (0.0295)
45°
0.25 (0.0098)
8°
0°
0.33 (0.0130)
0.20 (0.0079)
1.27 (0.0500)
0.40 (0.0157)
SEATING
PLANE
COMPLIANT TO JEDEC STANDARDS MS-013-AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 23. 16-Lead Standard Small Outline Package [SOIC_W]
Wide Body
(RW-16)
Dimensions shown in millimeters and (inches)
Rev. E | Page 11 of 16
03-27-2007-B
AD [ ANALOG DEVICES ]
