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ADM3055E 参数 Datasheet PDF下载

ADM3055E图片预览
型号: ADM3055E
PDF下载: 下载PDF文件 查看货源
内容描述: [Signal and Power Isolated, CAN Transceivers for CAN FD]
分类和应用:
文件页数/大小: 24 页 / 454 K
品牌: ADI [ ADI ]
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ADM3055E/ADM3057E  
Data Sheet  
APPLICATIONS INFORMATION  
PCB LAYOUT  
ADM3055E/  
ADM3057E  
Power supply bypassing is required at the logic input supply,  
VIO, and at the shared CAN transceiver and digital isolator  
input supply pin, VISOIN. Low equivalent series resistance (ESR)  
bypass capacitors are required and must be placed as close to  
the chip pads as possible. The ADM3055E and the ADM3057E  
signal and power isolated CAN transceivers do not require  
external interface circuitry for the logic interfaces.  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10µF 0.1µF  
0.1µF 0.01µF  
GND  
GND  
GND  
1
1
ISO  
ISOOUT  
0.22µF  
10µF  
V
3
V
V
GND  
CC  
IO  
ISO  
FERRITES  
0.01µF 0.1µF  
4
AUX  
OUT  
5
RXD  
V
ISOIN  
6
SILENT  
TXD  
GND  
2
7
CANH  
CANL  
RS  
8
STBY  
The integrated dc-to-dc converter supply input pin, VCC, requires  
parallel 10 µF and 0.1 µF bypass capacitors placed close to the  
pin. Noise suppression requires a low inductance, high frequency  
capacitor. Ripple suppression and proper regulation require a  
large value capacitor. Effective bypass capacitance is also  
required on the isolated output supply pin, VISOOUT, for proper  
operation of the integrated dc-to-dc converter. Note that the  
total trace length between the ends of the low ESR capacitors  
9
AUX  
IN  
R
SLOPE  
10  
GND  
GND  
1
2
Figure 33. Recommended PCB Layout  
THERMAL ANALYSIS  
The ADM3055E and the ADM3057E consist of six internal die  
attached to a split lead frame with four die attach pads. For the  
purposes of thermal analysis, the die are treated as a thermal  
unit, with the highest junction temperature reflected in the θJA  
value in Table 10. The θJA value is based on measurements taken  
with the devices mounted on a JEDEC standard, 4-layer board  
with fine width traces and still air. Under normal operating  
conditions, the ADM3055E and the ADM3057E can operate at  
full load across the full temperature range without derating the  
output current.  
and the input power supply pins, VCC, VIO, VISOIN, and VISOOUT  
must not exceed 2 mm.  
,
RADIATED EMISSIONS AND PCB LAYOUT  
The ADM3055E and the ADM3057E signal and power isolated  
CAN FD transceivers pass EN 55022 Class B by 6 dB on a 2-layer  
PCB design with ferrite beads. Neither PCB stitching capacitance  
nor high voltage surface-mounted technology (SMT) safety  
capacitors are required to meet this emissions level.  
INSULATION LIFETIME  
The ADM3055E and the ADM3057E have an internal split pad  
lead frame on the bus side to isolate noise generated by the dc-  
to-dc converter from the transceiver. For best noise suppression,  
filter both the VISOOUT power supply pin and GNDISO power  
supply return pin for high frequency currents before routing  
power to the transceiver. Use surface-mount ferrite beads in  
series with the signals, as shown in Figure 33.  
All insulation structures eventually break down when subjected  
to voltage stress over a sufficiently long period of time. The rate  
of insulation degradation is dependent on the characteristics of  
the voltage waveform applied across the insulation as well as on  
the materials and material interfaces.  
The two types of insulation degradation of primary interest are  
breakdown along surfaces exposed to the air and insulation  
wear out. Surface breakdown is the phenomenon of surface  
tracking and is the primary determinant of surface creepage  
requirements in system level standards. Insulation wear out  
is the phenomenon where charge injection or displacement  
currents inside the insulation material cause long-term  
insulation degradation.  
The isoPower integrated dc-to-dc converters of the ADM3055E  
and the ADM3057E produce a 180 MHz carrier frequency to  
transmit power through the chip scale transformer. The  
impedance of the ferrite bead must be approximately 2 kΩ  
between the 100 MHz and 1 GHz frequency range to reduce the  
emissions of the 180 MHz primary switching frequency and  
360 MHz secondary side rectifying frequency. See Table 14 for  
examples of appropriate surface-mount ferrite beads. Although  
the ferrite beads are beneficial for emissions performance, the  
ferrite beads are not required for functionality.  
Table 14. Surface-Mount Ferrite Beads Example  
Manufacturer  
Taiyo Yuden  
Murata Electronics  
Part No.  
BKH1005LM182-T  
BLM15HD182SN1  
Rev. A | Page 22 of 24  
 
 
 
 
 
 
 
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