ADG408/ADG409
ABSOLUTE MAXIMUM RATINGS1
ORDERING INFORMATION
(TA = +25°C unless otherwise noted)
Model1
Temperature Range
Package Option2
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+44 V
ADG408BN
ADG408BR
ADG408BRU
ADG408TQ
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
N-16
V
DD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +25 V
SS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –25 V
R-16A
RU-16
Q-16
V
Analog, Digital Inputs2 . . . . . VSS –2 V to VDD +2 V or 20 mA,
Whichever Occurs First
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 20 mA
Peak Current, S or D
(Pulsed at 1 ms, 10% Duty Cycle max) . . . . . . . . . . . 40 mA
ADG409BN
ADG409BR
ADG409TQ
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
N-16
R-16A
Q-16
Operating Temperature Range
NOTES
Industrial (B Version) . . . . . . . . . . . . . . . . . –40°C to +85°C
Extended (T Version) . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . . 900 mW
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 76°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +300°C
Plastic Package, Power Dissipation . . . . . . . . . . . . . . . 470 mW
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 117°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . +260°C
TSSOP Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . 155°C/W
θJC, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 50°C/W
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . . 600 mW
θJA, Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 77°C/W
Lead Temperature, Soldering
1To order MIL-STD-883, Class B processed parts, add /883B to T grade part
numbers.
2N = Plastic DIP; Q = Cerdip; R = 0.15" Small Outline IC (SOIC);
RU = Think Shrink Small Outline Package (TSSOP).
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at A, EN, S or D will be clamped by internal diodes. Current should
be limited to the maximum ratings given.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the ADG408/ADG409 feature proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
–4–
REV. A
ADI [ ADI ]
