ADF4110/ADF4111/ADF4112/ADF4113
t
3
CLOCK
t
4
t
1
DATA
DB20 (MSB)
DB19
t
2
DB2
DB1
(CONTROL BIT C2)
DB0 (LSB)
(CONTROL BIT C1)
t
6
LE
t
5
LE
Figure 1. Timing Diagram
ABSOLUTE MAXIMUM RATINGS
1, 2
(T
A
= 25°C unless otherwise noted)
AV
DD
to GND
3
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
AV
DD
to DV
DD
. . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
V
P
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
P
to AV
DD
. . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
Digital I/O Voltage to GND . . . . . . . . –0.3 V to V
DD
+ 0.3 V
Analog I/O Voltage to GND . . . . . . . . . –0.3 V to V
P
+ 0.3 V
REF
IN
, RF
IN
A, RF
IN
B to GND . . . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C
TSSOP
θ
JA
Thermal Impedance . . . . . . . . . . . . . 150.4°C/W
CSP
θ
JA
Thermal Impedance (Paddle Soldered) . . . 122°C/W
CSP
θ
JA
Thermal Impedance
(Paddle Not Soldered) . . . . . . . . . . . . . . . . . . . . . 216°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
This device is a high-performance RF integrated circuit with an ESD rating of
< 2 kV and it is ESD sensitive. Proper precautions should be taken for handling
and assembly.
3
GND = AGND = DGND = 0 V.
TRANSISTOR COUNT
6425 (CMOS) and 303 (Bipolar).
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumu-
late on the human body and test equipment and can discharge without detection. Although the
ADF4110/ADF4111/ADF4112/ADF4113 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
Model
ADF4110BRU
ADF4110BCP
ADF4111BRU
ADF4111BCP
ADF4112BRU
ADF4112BCP
ADF4113BRU
ADF4113BCP
ADF4113BCHIPS
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
DICE
Package Option*
RU-16
CP-20
RU-16
CP-20
RU-16
CP-20
RU-16
CP-20
DICE
*Contact
the factory for chip availability.
–4–
REV. 0
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