AD8615/AD8616/AD8618
ABSOLUTE MAXIMUM RATINGS
Table 3.
THERMAL RESISTANCE
Parameter
Rating
θJA is specified for the worst-case conditions, that is, θJA is
specified for device soldered in circuit board for surface-mount
packages.
Supply Voltage
Input Voltage
6 V
GND to VS
3 V
Indefinite
–65°C to +150°C
–40°C to +125°C
300°C
Differential Input Voltage
Output Short-Circuit Duration to GND
Storage Temperature
Operating Temperature Range
Lead Temperature Range (Soldering 60 sec)
Junction Temperature
Table 4.
Package Type
θJA
θJC
61
45
43
36
35
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
5–Lead TSOT-23 (UJ)
8-Lead MSOP (RM)
8-Lead SOIC (R)
14-Lead SOIC (R)
14-Lead TSSOP (RU)
207
210
158
120
180
150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only and functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 5 of 20
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