AD825
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Internal Power Dissipation
Small Outline (R)
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range (R, R-16)
Operating Temperature Range
Lead Temperature Range
(Soldering 10 sec)
Rating
±18 V
See Figure 6
±V
S
±V
S
See Figure 6
−65°C to +125°C
−40°C to +85°C
300°C
PIN CONFIGURATIONS
NC
1
–IN
2
8
NC
NC = NO CONNECT
Figure 4. 8-Lead SOIC
NC
1
NC
2
NC
3
–INPUT
4
16
15
14
NC
NC
NC
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
2.5
+V
S
TOP VIEW
+INPUT
5
(Not to Scale)
12
OUTPUT
11
NC
–V
S 6
13
AD825
NC
7
NC
8
10
9
NC
NC
00876-E-002
NC = NO CONNECT
Figure 5. 16-Lead SOIC
1
Specification is for device in free air:
8-lead SOIC package: θ
JA
= 155°C/W
16-lead SOIC package: θ
JA
= 85°C/W
MAXIMUM POWER DISSIPATION (W)
2.0
16-LEAD SOIC PACKAGE
1.5
1.0
0.5
8-LEAD SOIC PACKAGE
00876-E-001
7
+V
S
TOP VIEW
6
OUTPUT
(Not to Scale)
–V
S 4
5
NC
AD825
+IN
3
T
J
= 150°C
0
–50 –40 –30 –20 –10 0 10 20 30 40 50 60 70 80 90
AMBIENT TEMPERATURE (°C)
Figure 6. Maximum Power Dissipation vs. Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. F | Page 5 of 12
00876-E-004