AD820
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Internal Power Dissipation
8-Lead PDIP (N)
8-Lead SOIC_N (R)
8-Lead MSOP (RM)
Input Voltage
Output Short-Circuit Duration
Differential Input Voltage
Storage Temperature Range
8-Lead PDIP (N)
8-Lead SOIC_N (R)
8-Lead MSOP (RM)
Operating Temperature Range
AD820A/AD820B
Lead Temperature(Soldering, 60 sec)
1
THERMAL RESISTANCE
Rating
±18 V
1.6 W
1.0 W
0.8 W
((V+) + 0.2 V) to
(V−) − 20 V
Indefinite
±30 V
−65°C to +125°C
−65°C to +150°C
−65°C to +150°C
−40°C to +85°C
260°C
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type
8-Lead PDIP (N)
8-Lead SOIC_N (R)
8-Lead MSOP (RM)
θ
JA
90
160
190
Unit
°C/W
°C/W
°C/W
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
See Input Characteristics section.
ESD CAUTION
Rev. H | Page 9 of 24
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