AD8131
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
Supply Voltage
V
OCM
Internal Power Dissipation
Operating Temperature Range
Storage Temperature Range
Lead Temperature (Soldering 10 sec)
1
Rating
±5.5 V
±V
S
250 mW
−40°C to +125°C
−65°C to +150°C
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only, functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
2.0
T
J
= 150°C
MAXIMUM POWER DISSIPATION (W)
Thermal resistance measured on SEMI standard 4-layer board.
8-lead SOIC: θ
JA
= 121°C/W.
8-lead MSOP: θ
JA
= 142°C/W.
1.5
8-LEAD SOIC
PACKAGE
1.0
8-LEAD
MSOP
PACKAGE
0.5
01072-044
0
–50
–20
40
70
10
AMBIENT TEMPERATURE (°C)
100
130
Figure 3. Plot of Maximum Power Dissipation vs. Temperature
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. B | Page 7 of 20
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