AD8051/AD8052/AD8054
ABSOLUTE MAXIMUM RATINGS
Table 4.
Parameter
Supply Voltage
Internal Power Dissipation
SOIC Packages
SOT-23 Package
MSOP Package
TSSOP Package
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range (R)
Operating Temperature Range (A Grade)
Lead Temperature (Soldering 10 sec)
1
MAXIMUM POWER DISSIPATION
Ratings
12.6 V
Observe power
derating curves
Observe power
derating curves
Observe power
derating curves
Observe power
derating curves
±V
S
±2.5 V
Observe power
derating curves
−65°C to +150°C
−40°C to +125°C
300°C
The maximum power that can be safely dissipated by the
AD8051/AD8052/AD8054 is limited by the associated rise in
junction temperature. The maximum safe junction temperature
for plastic encapsulated devices is determined by the glass
transition temperature of the plastic, approximately 150°C.
Temporarily exceeding this limit can cause a shift in parametric
performance due to a change in the stresses exerted on the die
by the package. Exceeding a junction temperature of 175°C for
an extended period can result in device failure.
While the AD8051/AD8052/AD8054 are internally short-
circuit protected, this cannot be sufficient to guarantee that the
maximum junction temperature (150°C) is not exceeded under
all conditions. To ensure proper operation, it is necessary to
observe the maximum power derating curves.
2.5
MAXIMUM POWER DISSIPATION (W)
2.0
SOIC-14
TSSOP-14
See Table 5.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
1.5
SOIC-8
1.0
MSOP-8
0.5
SOT-23-5
–35
–15
5
15
35
55
75
95
115
Specification is for device in free air.
Table 5. Thermal Resistance
Package Type
8-Lead SOIC
5-Lead SOT-23
8-Lead MSOP
14-Lead SOIC
14-Lead TSSOP
θ
JA
125
180
150
90
120
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
AMBIENT TEMPERATURE (°C)
Figure 6. Maximum Power Dissipation vs.
Temperature for AD8051/AD8052/AD8054
ESD CAUTION
Rev. H | Page 9 of 24
01062-006
THERMAL RESISTANCE
0
–55
AD [ ANALOG DEVICES ]
