AD7892
Parameter
LOGIC OUTPUTS
Output High Voltage, V
OH
Output Low Voltage, V
OL
DB11–DB0
Floating-State Leakage Current
Floating-State Capacitance
4
Output Coding
AD7892-1 and AD7892-3
AD7892-2
CONVERSION RATE
Conversion Time
Track/Hold Acquisition Time
3
Conversion Time
Track/Hold Acquisition Time
3
POWER REQUIREMENTS
V
DD
I
DD5
Normal Operation
Standby Mode
6
AD7892-2
AD7892-3, AD7892-1
Power Dissipation
5
Normal Operation
Standby Mode
6
AD7892-2
AD7892-3, AD7892-1
A Versions
1
4.0
0.4
±
10
15
B Versions
4.0
0.4
±
10
15
S Version
2
4.0
0.4
±
10
15
Unit
V min
V max
µA
max
pF max
Test Conditions/Comments
I
SOURCE
= 200
µA
I
SINK
= 1.6 mA
Two’s Complement
Straight (Natural) Binary
1.47
0.2
1.6
0.4
+5
18
250
80
90
1.25
400
1.47
0.2
1.6
0.4
+5
18
250
80
90
1.25
400
µs
max
µs
max
µs
max
µs
max
V nom
mA max
µA
typ
µA
max
mW max
mW typ
µW
max
AD7892-3
AD7892-3
AD7892-1 and AD7892-2
AD7892-1 and AD7892-2
±
5% for Specified Performance
1.68
0.32
+5
19
100
95
typ 15
µA
V
DD
= +5 V. Typically 60 mW
500
V
DD
= +5 V. Typically 75
µW
NOTES
1
Temperature ranges are as follows: A, B Versions: –40°C to +85°C; S Version: –55°C to +125°C.
2
S Version available on AD7892-1 and AD7892-2 only.
3
See Terminology.
4
Sample tested @ +25°C to ensure compliance.
5
These normal mode and standby mode currents are achieved with resistors (in the range 10 kΩ to 100 kΩ) to either DGND or V
DD
on Pins 8, 9, 16 and 17.
6
A conversion should not be initiated on the part within 30
µs
of exiting standby mode.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25°C unless otherwise noted)
V
DD
to AGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
Analog Input Voltage to AGND
AD7892-1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
17 V
AD7892-2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, V
DD
AD7892-3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
±
7 V
Reference Input Voltage to AGND . . . –0.3 V to V
DD
+ 0.3 V
Digital Input Voltage to DGND . . . . . –0.3 V to V
DD
+ 0.3 V
Digital Output Voltage to DGND . . . . –0.3 V to V
DD
+ 0.3 V
Operating Temperature Range
Commercial (A, B Versions) . . . . . . . . . . . –40°C to +85°C
Extended (S Version) . . . . . . . . . . . . . . . . –55°C to +125°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Plastic DIP Package, Power Dissipation . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . 105°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +260°C
Cerdip Package, Power Dissipation . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 70°C/W
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . +300°C
SOIC Package, Power Dissipation . . . . . . . . . . . . . . . 450 mW
θ
JA
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 75°C/W
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . +215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . +220°C
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
REV. C
–3–
AD [ ANALOG DEVICES ]
