Data Sheet
AD7873
4.10
4.00 SQ
3.90
0.35
0.30
0.25
PIN 1
INDICATOR
PIN 1
INDICATOR
13
16
0.65
BSC
1
4
12
EXPOSED
PAD
2.25
2.10 SQ
1.95
9
8
5
0.70
0.60
0.50
0.25 MIN
TOP VIEW
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
0.80
0.75
0.70
0.05 MAX
0.02 NOM
COPLANARITY
0.08
SECTION OF THIS DATA SHEET.
SEATING
PLANE
0.20 REF
COMPLIANT TO JEDEC STANDARDS MO-220-WGGC.
Figure 42. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-16-23)
Dimensions shown in millimeters
ORDERING GUIDE
Model1
AD7873ARQZ
AD7873ARQZ-REEL
AD7873ARQZ-REEL7
AD7873BRQZ
AD7873BRQZ-REEL
AD7873BRQZ-REEL7
AD7873ARUZ
AD7873ARUZ-REEL
AD7873ARUZ-REEL7
AD7873ACPZ
AD7873ACPZ-REEL
AD7873ACPZ-REEL7
EVAL-AD7873EBZ
Temperature Range
–ꢀ0°C to +85°C
–ꢀ0°C to +85°C
–ꢀ0°C to +85°C
–ꢀ0°C to +85°C
–ꢀ0°C to +85°C
–ꢀ0°C to +85°C
–ꢀ0°C to +85°C
–ꢀ0°C to +85°C
–ꢀ0°C to +85°C
–ꢀ0°C to +85°C
–ꢀ0°C to +85°C
–ꢀ0°C to +85°C
Package Description
1±-Lead QSOP
1±-Lead QSOP
Linearity Error (LSB)2
Package Option3
±2
±2
±2
±1
±1
±1
±2
±2
±2
±2
±2
±2
RQ-1±
RQ-1±
RQ-1±
1±-Lead QSOP
1±-Lead QSOP
1±-Lead QSOP
1±-Lead QSOP
RQ-1±
RQ-1±
RQ-1±
1±-Lead TSSOP
1±-Lead TSSOP
1±-Lead TSSOP
1±-Lead LFCSP_WQ
1±-Lead LFCSP_WQ
1±-Lead LFCSP_WQ
Evaluation Board
RU-1±
RU-1±
RU-1±
CP-1±-23
CP-1±-23
CP-1±-23
1 Z = RoHS Compliant Part.
2 Linearity error here refers to integral linearity error.
3 RQ = QSOP = 0.15 inch quarter size outline package; RU = TSSOP, CP = LFCSP.
Rev. F | Page 25 of 28
ADI [ ADI ]
