AD7705/AD7706
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Parameters
Ratings
VDD to GND
−0.3 V to +7 V
Analog Input Voltage to GND
Reference Input Voltage to GND
Digital Input Voltage to GND
Digital Output Voltage to GND
Operating Temperature Range
Commercial (B Version)
Storage Temperature Range
Junction Temperature
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−0.3 V to VDD + 0.3 V
−40°C to + 85°C
−65°C to + 150°C
150°C
PDIP Package, Power Dissipation
θJA Thermal Impedance
Lead Temperature (Soldering, 10 sec)
SOIC Package, Power Dissipation
θJA Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
450 mW
105°C/W
260°C
450 mW
75°C/W
215°C
Infrared (15 sec)
220°C
SSOP Package, Power Dissipation
θJA Thermal Impedance
Lead Temperature, Soldering
Vapor Phase (60 sec)
450 mW
139°C/W
215°C
Infrared (15 sec)
220°C
ESD Rating
>4000 V
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
Rev. C | Page 9 of 44
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