AD7537
TIMING CHARACTERISTICS
Parameter
t
1
t
2
t
3
t
4
t
5
t
6
t
7
t
8
Limit at
T
A
= +25 C
15
15
60
25
0
0
80
80
(V
DD
= +10.8 V to +16.5 V, V
REFA
= V
REFB
= +10 V; I
OUTA
= AGNDA = 0 V, I
OUTB
= AGNDB = 0 V.)
Limit at
T
A
= +55 C
to +125 C
30
25
80
25
0
0
100
100
Limit at
T
A
= –40 C
to +85 C
15
15
80
25
0
0
80
80
Units
ns min
ns min
ns min
ns min
ns min
ns min
ns min
ns min
Test Conditions/Comments
Address Valid to Write Setup Time
Address Valid to Write Hold Time
Data Setup Time
Data Hold Time
Chip Select or Update to Write Setup Time
Chip Select or Update to Write Hold Time
Write Pulse Width
Clear Pulse Width
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS*
(T
A
= +25°C unless otherwise stated)
V
DD
to DGND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V, +17 V
V
REFA
, V
REFB
to AGNDA, AGNDB . . . . . . . . . . . . . . . .
±
25 V
V
RFBA
, V
RFBB
to AGNDA, AGNDB . . . . . . . . . . . . . . . .
±
25 V
Digital Input Voltage to DGND . . . . . . . –0.3 V, V
DD
+0.3 V
I
OUTA
, I
OUTB
to DGND . . . . . . . . . . . . . . –0.3 V, V
DD
+0.3 V
AGNDA, AGNDB to DGND . . . . . . . . . –0.3 V, V
DD
+0.3 V
Power Dissipation (Any Package)
To +75°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 450 mW
Derates Above +75°C . . . . . . . . . . . . . . . . . . . . . 6 mW/°C
Operating Temperature Range
Commercial Plastic (J, K, L Versions) . . . . –40°C to +85°C
Industrial Hermetic (A, B, C Versions) . . . –40°C to +85°C
Extended Hermetic (S, T, U Versions) . . –55°C to +125°C
Storage Temperature . . . . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering, 10 sec) . . . . . . . . . . . . +300°C
*Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those indicated in
the operational sections of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection.
Although the AD7537 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
ORDERING GUIDE
1
Model
2
Temperature
Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
–55°C to +125°C
Relative Gain
Accuracy Error
±
1 LSB
±
1/2 LSB
±
1/2 LSB
±
1 LSB
±
1/2 LSB
±
1/2 LSB
±
1 LSB
±
1/2 LSB
±
1/2 LSB
±
1 LSB
±
1/2 LSB
±
1/2 LSB
±
1 LSB
±
1/2 LSB
±
1/2 LSB
±
6 LSB
±
3 LSB
±
1 LSB
±
6 LSB
±
3 LSB
±
1 LSB
±
6 LSB
±
3 LSB
±
1 LSB
±
6 LSB
±
3 LSB
±
2 LSB
±
6 LSB
±
3 LSB
±
2 LSB
Package
Option
3
N-24
N-24
N-24
P-28A
P-28A
P-28A
Q-24
Q-24
Q-24
Q-24
Q-24
Q-24
E-28A
E-28A
E-28A
Figure 1. Timing Diagram
AD7537JN
AD7537KN
AD7537LN
AD7537JP
AD7537KP
AD7537LP
AD7537AQ
AD7537BQ
AD7537CQ
AD7537SQ
AD7537TQ
AD7537UQ
AD7537SE
AD7537TE
AD7537UE
NOTES
1
Analog Devices reserves the right to ship ceramic packages (D-24A) in lieu of
cerdip packages (Q-24).
2
To order MIL-STD-883, Class B processed parts, add/883B to part number.
Contact your local sales office for military data sheet.
3
E = Leadless Ceramic Chip Carrier; N = Plastic DIP; P = Plastic Leaded Chip
Carrier; Q = Cerdip.
REV. 0
–3–
AD [ ANALOG DEVICES ]
