AD628
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter
Supply Voltage
Internal Power Dissipation
Input Voltage (Common Mode)
Differential Input Voltage
Output Short-Circuit Duration
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
1
Rating
±18 V
See Figure 3
±120 V
±120 V
Indefinite
−65°C to +125°C
–40°C to +85°C
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL CHARACTERISTICS
1.6
T
J
= 150°C
1.4
When using ±12 V supplies or higher, see the Input Voltage Range section.
POWER DISSIPATION (W)
1.2
8-LEAD MSOP PACKAGE
1.0
0.8
0.6
0.4
0.2
0
–60
MSOP
θ
JA
(JEDEC; 4-LAYER BOARD) = 132.54°C/W
SOIC
θ
JA
(JEDEC; 4-LAYER BOARD) = 154°C/W
–40
–20
0
20
40
60
80
100
02992-003
8-LEAD SOIC PACKAGE
AMBIENT TEMPERATURE (°C)
Figure 3. Maximum Power Dissipation vs. Temperature
ESD CAUTION
Rev. G | Page 7 of 20
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