AD840
NOTES
1Input offset voltage specifications are guaranteed after 5 minutes at TA = +25°C.
2Full power bandwidth = slew rate/2 π VPEAK
.
3Refer to Figures 22 and 23.
4“S” grade TMIN–TMAX specifications are tested with automatic test equipment at TA = –55°C and TA = +125°C.
All min and max specifications are guaranteed. Specifications shown in boldface are tested on all production units.
Specifications subject to change without notice.
ABSOLUTE MAXIMUM RATINGS1
Plastic DIP (N) Package
and
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V
Internal Power Dissipation2
Cerdip (Q) Package
Plastic (N) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5 W
Cerdip (Q) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.3 W
LCC (E) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0 W
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±VS
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . ±6 V
Storage Temperature Range
Q, E . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65°C to +150°C
N . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–65°C to +125°C
Junction Temperature (TJ) . . . . . . . . . . . . . . . . . . . . . +175°C
Lead Temperature Range (Soldering 60 sec) . . . . . . . . +300°C
NOTES
1Stresses above those listed under “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress rating only, and functional
operation of the device at these or any other conditions above those indicated in
the operational section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
2Maximum internal power dissipation is specified so that TJ does not exceed
+175°C at an ambient temperature of +25°C.
LCC (E) Package
Thermal Characteristics:
θJC
θJA
Derate at
Cerdip Package
Plastic Package
LCC Package
30°C/W
30°C/W
35°C/W
110°C/W
100°C/T
150°C/W
8.7 mW/°C
10 mW/°C
6.7 mW/°C
Recommended Heat Sink:
Aavid Engineering© #602B
ORDERING GUIDE
Package Options2
Models
AD840JN
AD840KN
AD840JQ
AD840KQ
N-14
N-14
Q-14
Q-14
Q-14
Q-14
Q-14
E-20A
E-20A
AD840 Connection Diagrams
METALIZATION PHOTOGRAPH
Contact factory for latest dimensions.
Dimensions shown in inches and (mm).
AD840SQ
AD840SQ-883B
5962-89640012A
AD840SE-883B
5962-8964001CA
NOTES
1J and S Grade Chips also available.
2N = Plastic DIP; Q = Cerdip; E = LCC (Leadless
2Ceramic Chip Carrier).
REV. C
–3–
ADI [ ADI ]
