AMP01
OUTLINE DIMENSIONS
Dimensions shown in inches and (mm).
18-Lead Cerdip
(Q-18)
0.005 (0.13) MIN
0.098 (2.49) MAX
18
10
0.310 (7.87)
0.220 (5.59)
1
9
0.320 (8.13)
0.290 (7.37)
PIN 1
0.960 (24.38) MAX
0.060 (1.52)
0.015 (0.38)
0.200 (5.08)
MAX
0.150
(3.81)
MIN
0.200 (5.08)
0.125 (3.18)
0.015 (0.38)
0.008 (0.20)
0.023 (0.58)
0.014 (0.36)
SEATING
PLANE
0.100
(2.54)
BSC
0.070 (1.78)
0.030 (0.76)
15؇
0؇
28-Terminal Ceramic Leadless Chip Carrier
(E-28A)
0.300 (7.62)
BSC
0.075
(1.91)
REF
0.100 (2.54)
0.064 (1.63)
0.150
(3.51)
BSC
0.015 (0.38)
MIN
0.095 (2.41)
0.075 (1.90)
26
4
28
25
5
0.028 (0.71)
0.022 (0.56)
0.458 (11.63)
1
0.442 (11.23)
SQ
0.458
0.011 (0.28)
0.007 (0.18)
R TYP
BOTTOM
VIEW
(11.63)
MAX
SQ
0.050
(1.27)
BSC
0.075
(1.91)
REF
19
18
12
11
45؇ TYP
0.200
(5.08)
BSC
0.055 (1.40)
0.045 (1.14)
0.088 (2.24)
0.054 (1.37)
20-Lead SOIC
(R-20)
0.5118 (13.00)
0.4961 (12.60)
20
11
1
10
PIN 1
0.1043 (2.65)
0.0926 (2.35)
0.0291 (0.74)
0.0098 (0.25)
0.0500 (1.27)
0.0157 (0.40)
8؇
0؇
0.0118 (0.30)
0.0040 (0.10)
0.0500
(1.27)
BSC
0.0192 (0.49)
0.0138 (0.35)
SEATING
PLANE
0.0125 (0.32)
0.0091 (0.23)
REV. D
–22–
ADI [ ADI ]
