1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Descriptive designator
Terminals
Package style
C
D
2
3
K
GDIP1-T14 or CDIP2-T14
GDFP1-F14 or CDFP2-F14
CQCC1-N20
CQCC1-N28
GDFP2-F24 or CDFP3-F24
14
14
20
28
24
Dual-in-line
Flat pack
Square leadless chip carrier
Square leadless chip carrier
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,
appendix A for device class M.
1.3 Absolute maximum ratings. 1/
Supply voltage (VCC) ....................................................... ±18 V dc
Differential input voltage .................................................. ±1 V dc 2/
Differential input current .................................................. ±25 mA 2/
Input voltage .................................................................... Supply voltage
Output short circuit duration ............................................ Continuous
Storage temperature range ............................................. -65°C to +150°C
Lead temperature (soldering, 60 seconds) ..................... +300°C
Power dissipation (PD):
Cases C and 2 ............................................................. 800 mW
Case D ......................................................................... 550 mW
Case 3 ......................................................................... 500 mW
Case K ......................................................................... 440 mW
Maximum junction temperature (TJ) ................................ +150°C
Thermal resistance, junction-to-case (θJC) ...................... See MIL-STD-1835
Thermal resistance, junction-to-ambient (θJA):
Cases C and 2 ............................................................. 100°C/W
Case D ......................................................................... 140°C/W
Case 3 ......................................................................... 110°C/W
Case K ......................................................................... 69°C/W
1.4 Recommended operating conditions.
Ambient operating temperature range (TA) ..................... -55°C to +125°C
Supply voltage (VCC) ....................................................... ±15 V
1.5 Radiation features.
Maximum total dose available (dose rate = 50 – 300 rads(Si)/s)................. 100 Krads(Si) 3/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ The inputs are protected by back-to-back diodes. Current limiting resistors are not used in order to achieve low noise
performance. If the differential input voltage exceeds ±1 V, the input current should be limited to ±25 mA.
3/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method
1019, condition A.
SIZE
STANDARD
5962-88565
A
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
REVISION LEVEL
F
SHEET
3
DSCC FORM 2234
APR 97
ADI [ ADI ]
