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502R29W151KV3E-SC 参数 Datasheet PDF下载

502R29W151KV3E-SC图片预览
型号: 502R29W151KV3E-SC
PDF下载: 下载PDF文件 查看货源
内容描述: 辐射发射与iCoupler器件的控制建议 [Recommendations for Control of Radiated Emissions with iCoupler Devices]
分类和应用:
文件页数/大小: 20 页 / 645 K
品牌: ADI [ ADI ]
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Application Note  
AN-1109  
Overlapping Stitching Capacitor  
An example of a floating stitching capacitance is shown in  
Figure 8. The reference planes are shown in blue and green, and  
the floating coupling plane is shown in yellow. The capacitance  
of this structure creates two capacitive regions (shown with  
shading) linked by the nonoverlapping portion of the structure.  
To ensure that there is no dc voltage accumulated on the  
coupling plane, the area on the primary and secondary should  
be approximately equal.  
A simple method of achieving a good stitching capacitance is to  
extend a reference plane from the primary and secondary sides  
into the area that is used for creepage on the PCB surface.  
W
I
W
W
2
1
I
d
Figure 7. Overlapping Plane Stitching Capacitance  
The capacitive coupling of the structure in Figure 7 is calculated  
with the following basic relationships for parallel plate capacitors:  
d
Aε  
d
Figure 8. Floating Stitching Capacitance  
C =  
and ε = ε0 × εr  
The capacitive coupling of the structure in Figure 8 is calculated  
with the following basic relationships for parallel plate capacitors:  
where:  
C is the total stitching capacitance.  
Axε  
d
c1 ×c2  
c1 +c2  
Cx =  
, ε = ε0 x εr, C =  
A is the overlap area of the stitching capacitance.  
ε0 is the permittivity of free space, 8.854 × 10−12 F/m.  
εr is the relative permittivity of the PCB insulation material,  
which is about 4.5 for FR4, as shown in Table 2.  
where:  
C is the total stitching capacitance.  
A is the overlap area of the stitching capacitance.  
ε0 is the permittivity of free space, 8.854 × 10−12 F/m.  
εr is the relative permittivity of the PCB insulation material,  
which is about 4.5 for FR4, as shown in Table 2.  
lwε  
C =  
(1)  
d
where w, d, and l are the dimensions of the overlapping portion  
of the primary and secondary reference planes as shown in  
Figure 7.  
w1 ×w2  
w1 + w2  
lε  
d
C =  
×
(2)  
(3)  
The major advantage of this structure is that the capacitance is  
created in the gap beneath the isolator, where the top and  
bottom layers must remain clear for creepage and clearance  
reasons. This board area is not utilized in most designs. The  
capacitance created is also twice as efficient per unit area as the  
floating plane.  
where w1, w2, d, and l are the dimensions of the overlapping  
portions of the floating plane and the primary and secondary  
reference planes as shown in Figure 8.  
If w1 = w2, the equation simplifies to  
lw1ε  
C =  
This architecture has only a single cemented joint and a single  
layer of FR4 between the primary and secondary reference  
planes. It is well suited to smaller boards where only basic  
insulation is required.  
2d  
There are advantages and disadvantages to this structure in real  
applications. The major advantage is that there are two isolation  
gaps, one at the primary and one at the secondary. These gaps  
are referred to as cemented joints, where the bonding between  
layers of FR4 provides the isolation.  
Table 2. Electrical Properties  
Dielectric Constant  
at 1 MHz  
Dielectric Strength  
(V/mil)  
Type  
FR4  
There are also two sequential paths through the thickness of the  
PCB material. The presence of these gaps and thicknesses is  
advantageous when creating a reinforced isolation barrier under  
some isolation standards. The disadvantage of this type of  
structure is that the capacitance is formed under the active circuit  
area so there can be via penetrations and traces that run across  
the gaps. Equation 2 also shows that the net capacitance result-  
ing from two capacitors in series is only half the value that  
results from using the same PCB area to form a single capacitor.  
Therefore, this technique is less efficient from a capacitance per  
unit area perspective. Overall, it is best suited to applications  
4.5  
1000 to 1500  
1000 to 1200  
750  
GETEK  
3.6 to 4.2  
BT-Epoxy 4.0  
Floating Stitching Capacitor  
A good option is to use a floating metal structure on an interior  
layer of the board to bridge between the primary and secondary  
power planes. Note that planes dedicated to ground or power  
are referred to as reference planes in this application note  
because, from an ac noise perspective, they behave the same  
and can be used interchangeably for stitching capacitance.  
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