Data Sheet
HMC674LC3C/HMC674LP3E
APPLICATIONS INFORMATION
the package ground leads must be connected directly to the ground
plane similar to that shown in Figure 15. Use a sufficient number
of via holes to connect the top and bottom ground planes to
provide good RF grounding to 10 GHz. The evaluation PCB shown
in Figure 13 is available from Analog Devices, Inc., upon request.
EVALUATION PRINTED CIRCUIT BOARD (PCB)
Figure 13 shows the front side of the evaluation PCB, and
Figure 14 shows the back side of the evaluation PCB.
The evaluation PCB used in the application must use RF circuit
design techniques. Signal lines must have 50 Ω impedance, and
Figure 13. Front Side of the Evaluation PCB
Figure 14. Back Side of the Evaluation PCB
Rev. K | Page 11 of 14
ADI [ ADI ]
